1. Vibration and Impact
   Do not expose a capacitor or its leads to excessive
   shock or vibration during use.
2. Soldering
   When soldering this product to a PCB/PWB, do not
   exceed the solder heat resistance specification of
   the capacitor. Subjecting this product to excessive
   heating could melt the internal junction solder and
   may result in thermal shocks that can crack the
   ceramic element.
   When soldering capacitor with a soldering iron, it
   should be performed in following conditions.
     Temperature of iron-tip: 400 degrees C. max.
     Soldering iron wattage : 50W max.
     Soldering time         : 3.5 sec. max.
3. Bonding, Resin Molding and Coating
    In case of bonding, molding or coating this product,
    verify that these processes do not affect the quality
    of capacitor by testing the performance of the bonded,
    molded or coated product in the intended equipment. 
    In case the amount of applications, dryness/hardening
    conditions of adhesives and molding resins containing
    organic solvents (ethyl acetate, methyl ethyl ketone,
    toluene, etc.) are unsuitable, the outer coating resin 
    of a capacitor is damaged by the organic solvents and 
    it may result, worst case, in a short circuit.
    The variation in thickness of adhesive, molding resin 
    or coating may cause outer coating resin cracking 
    and/or ceramic element cracking of a capacitor in a 
    temperature cycling.
4. Treatment after Bonding, Resin Molding and Coating
    When the outer coating is hot (over 100 ��) after 
    soldering, it becomes soft and fragile. 
    So please be careful not to give it mechanical 
    stress.
 
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY 
RESULT, WORST CASE, IN A SHORT CIRCUIT 
AND CAUSE FUMING OR PARTIAL DISPERSION 
WHEN THE PRODUCT IS USED.